RESPONSIBILITIES:

• Serve as the technical lead for advanced semiconductor packaging materials.
• Work directly with customers to optimize wafer or panel-level encapsulation and molding processes.
• Troubleshoot complex material and process issues for both developmental and commercial products.
• Ensure successful product adoption by delivering clear, measurable value to customers.
• Solve technology-specific challenges across product lines through innovative application development and material characterization.
• Collaborate closely with R&D, sales, and product teams to translate customer needs into technical solutions.

BACKGROUND PROFILE:

• Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field.
• 10+ years of experience in semiconductor advanced packaging materials or processes.
• Strong expertise in wafer-level encapsulation and molding technologies.
• Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging.
• Proven ability to work independently and lead technical discussions with customers.
• Strong communication skills with a customer-focused, ownership-driven mindset.
• Effective project and time management skills, with a consistent focus on quality and delivery.
• Willingness to travel up to 10%.