As a Sr. Engineer, (PCB Substrates) you'll bridge the company's advanced PCB and IC-substrate technology and the customers building the next generation of high-performance computing.

WHAT YOU'LL OWN

● Provide hands-on technical support to major customers across the company's PCB and IC-substrate portfolio.

● Partner with account managers as the technical authority in customer engagements — translating customer requirements into the company's solutions.

● Support advanced-technology programs, including embedding (embedded-component packaging) and next-generation IC substrates.

● Guide design-in, troubleshoot, and manage technical qualification with customers.

● Work cross-functionally with engineering and manufacturing teams in Europe and Asia.

● Grow into a go-to technology expert for the Americas.

WHAT YOU BRING

● BS or MS in Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering.

● Roughly 2–7 years in a customer-facing technical role (field applications, applications, or process / product engineering). Outstanding early-career candidates (0–2 years) with the right aptitude are encouraged to apply.

● A strong technical foundation in PCBs, IC substrates, semiconductor packaging, or a closely related electronics discipline.

● Clear customer-facing communication and a collaborative, high-energy, roll-up-your-sleeves mindset.

● Willingness to travel to customer sites.

Preferred

● Exposure to IC substrates, advanced packaging, HDI / mSAP PCBs, or embedding technology.

● Experience supporting semiconductor, hyperscaler or OEM customers.